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Processing technology aimed at improving the cooling performance of copper heat sinks.

Thinning the fins and narrowing the pitch of the copper heat sink using a special method! Cooling performance of the heat sink improved by over 25%! (According to our simulation results)

We are developing a "fin processing technology for heat sinks used in power semiconductor cooling" that excavates copper plates with special tools, achieving thinning of cooling fins and narrowing of pitch. By adopting a special method, we can process copper to achieve fin thinning and pitch narrowing compared to conventional extruded products, resulting in a significant improvement in the cooling performance of heat sinks! Our simulations show that we can produce copper heat sinks with over 25% higher cooling performance compared to aluminum extruded products, while reducing volume by 92% and weight by 75%! Additionally, we can accommodate various fin shapes and meet the needs for increased thermal conductivity due to turbulence. 【Features】 ■ Significantly reduced volume and weight compared to extruded heat sink products ■ Suitable for cooling EV vehicle inverters and various semiconductors ■ Compatible with aluminum and copper materials, addressing both cost and cooling power needs *For more details, please refer to the PDF document. Feel free to contact us with any inquiries.